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Product Name:PCB Products
Product Model:
Product Brief:
Project The current capacity 2014
The highest level  68 layer 68 layer
The minimum line width / spacing 3mil/3mil 2.5mil/2.5mil
The largest copper thickness 10 OZ 10 OZ
The minimum Kong Jing Mechanical drilling of 4 mil
Laser drilling of 3 mil
Mechanical drilling of 4 mil
Laser drilling of 2 mil
The maximum thickness to diameter ratio 18:1 22:1
Impedance control tolerance  ±5% ±3%
Form tolerances  ±0.1mm ±0.1mm
Material Science FR-4, Tg, halogen, ceramic filled, PTFE, PI, BT, PPO, PPE, RF / microwave (Rogers, Taconic, Arlon, F4B), metal matrix / core (aluminum and copper, iron) Metal based/core
Surface treatment HASL, OSP, gold, gold, silver, tin deposition
Special processing Rigid flex, buried, buried, buried core fiber capacitance / resistance, three order HDI, disk stack hole plate, the inner / outer layer hollow board, high TG thick copper, mixed compression, local mixed compression, surface coating, metal substrate / core plate, plate edge metallization, buried hole, blind hole, step groove, local high density, back drilling, impedance control
• Mellanxo: Infiniscale IV
• Cavium Networks:CN36XX,CN38XX,CN50XX,CN52XX,CN53XX,CN56XX,CN58XX
• RMI:XLR732,XLS108,XLS208,XLS408,XLS608,XLS416,XLS616,XLR300 series,AU1300,AU1250 Demo board designed by Hampoo
• Broadcom:BCM56720,BCM56700,BCM56624,BCM56626,BCM56628,BCM56504,BCM56310,BCM56314,BCM1255,BCM1250,BCM1125,BCM5464,BCM5482,BCM5691,BCM5670,BCM5690,BCM5389,BCM5324,BCM5396
• Cortina:CS1999,CS1777,IXF18105,IXF1110
• Dune Networks:FAP10V,FAP20V,FAP21V,FE200
• Marvell:98DX241,88E1145,98FX9110,98EX125
• Xilinx:Spartan 3,Virtes 4,Virtes5 LX30/LX50/LX110/LX330
• Altera:EP1AGX50D,EP3SL110,EP1AGX60D,EP2S30
• TI:C6415,C6416,C5561,DM642,C6417,C6446 Davinci series,ADS62C15
• INTEL:2850,2800,2400,1200,425,82598,82546,82573,PXA255,PXA270,P945,P965,ATOM series
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