PCB program design
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PCB program design
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Name:PCB program design
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Project The current capacity 2014
The highest level  68 layer 68 layer
The minimum line width / spacing 3mil/3mil 2.5mil/2.5mil
The largest copper thickness 10 OZ 10 OZ
The minimum Kong Jing Mechanical drilling of 4 mil
Laser drilling of 3 mil
Mechanical drilling of 4 mil
Laser drilling of 2 mil
The maximum thickness to diameter ratio 18:1 22:1
Impedance control tolerance  ±5% ±3%
Form tolerances  ±0.1mm ±0.1mm
Material Science FR-4, Tg, halogen, ceramic filled, PTFE, PI, BT, PPO, PPE, RF / microwave (Rogers, Taconic, Arlon, F4B), metal matrix / core (aluminum and copper, iron) Metal based/core
Surface treatment HASL, OSP, gold, gold, silver, tin deposition
Special processing Rigid flex, buried, buried, buried core fiber capacitance / resistance, three order HDI, disk stack hole plate, the inner / outer layer hollow board, high TG thick copper, mixed compression, local mixed compression, surface coating, metal substrate / core plate, plate edge metallization, buried hole, blind hole, step groove, local high density, back drilling, impedance control
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